Diamond Thermal Interfaces
Why attachment layers, flatness and contact quality matter as much as diamond conductivity.
What this topic covers
Why attachment layers, flatness and contact quality matter as much as diamond conductivity.
Core engineering ideas
Heat must cross several interfaces before it reaches a diamond spreader and again before leaving it.
Voids, roughness and low-conductivity attachment materials increase thermal resistance.
Package design therefore evaluates the whole heat path rather than quoting only the diamond's bulk conductivity.
System tradeoffs
Synthetic plates and films are specified by thermal performance, dimensions, flatness, defect level and integration method.
Quality and verification
Package-level testing is more meaningful than quoting an ideal bulk conductivity number by itself.
Lifecycle perspective
Diamond competes with copper, ceramics, silicon carbide and other thermal materials on cost, electrical behaviour, density and manufacturability.