Diamond vs Copper, SiC and Other Thermal Materials
Compare thermal conductivity with density, electrical behaviour, cost and manufacturability.
What this topic covers
Compare thermal conductivity with density, electrical behaviour, cost and manufacturability.
Core engineering ideas
Copper is inexpensive and highly conductive but electrically conductive and much denser than some alternatives.
Silicon carbide and ceramics can combine insulation with easier integration in some packages.
Diamond is most attractive where extreme local thermal performance justifies its cost.
System tradeoffs
Synthetic plates and films are specified by thermal performance, dimensions, flatness, defect level and integration method.
Quality and verification
Package-level testing is more meaningful than quoting an ideal bulk conductivity number by itself.
Lifecycle perspective
Diamond competes with copper, ceramics, silicon carbide and other thermal materials on cost, electrical behaviour, density and manufacturability.